definition

Wafer scribing is an essential process in the semiconductor chip manufacturing process, which is a post-process in wafer manufacturing. Will do a good job of the entire chip wafer chip size divided into a single chip (die), called wafer dicing.

With the technology we now have, we are currently only able to apply this to a mesa chip, a triac, a flip-chip wafer, produced in a process known as the GPP (Glass Passivation Process) in the semiconductor industry , Compared with the traditional scribing process has greater advantages, at present there are many domestic factories producing this process to manufacture GPP wafers and finished products. Out of the high demand for better product quality, many factories are continuously devoting themselves to seeking new processes to improve work efficiency in product development, scientific research, quality management and other aspects, thus providing customers with higher quality products.

In the wafer scribing industry, there are mainly two kinds of cutting processes, one is traditional blade cutting, and the other is a new type of modern process laser scribing. In the following, the advantages of laser scribing will be demonstrated by comparing two cutting processes.

Blade dicing

The earliest wafers were scribed (diced) using a dicing system, which still holds a larger share of the world's chip-cutting market today, especially in the area of non-integrated circuit wafer scribing. Diamond saw blade (grinding wheel) dicing method is the common wafer dicing method. Principle: When the work is a hard, brittle material, diamond particles will be the way of the impact (Fracturing), the work piece cracked, and then use the knife to remove the powder.

Problems

● blade scribing directly on the wafer surface, resulting in damage within the crystal, prone to wafer chipping and wafer damage;

● blade has a certain thickness, resulting in a larger scribing line cutter width;

● consumables, blades need to be changed every half a month;

● Environmental pollution, cut silicon powder water difficult to deal with.

Laser dicing

Due to the advantages of the laser in focusing, the focus can be as small as submicrometer, giving the micromachining of the wafer an advantage over small parts. Even at low pulse energy levels, higher energy densities can be achieved and material processing is more efficient. Laser scribing is a non-contact processing, chip breakage and other damage can be avoided.

Processing advantages

● The high beam quality fiber laser used in laser scribing has a small influence on the electrical properties of the chip and can improve the scribing yield;

● Laser scribing speed, up to 150mm / s;

● Laser can work with different thickness of the wafer, with better compatibility and versatility;

● laser can cut some of the more complex wafer chips, such as hexagonal die;

● Laser scribing does not require deionized water, there is no tool wear problems, and 24 hours of continuous work.

Customer benefits

Kenbo Technology is committed to providing customers with a full range of solutions. After analyzing the customer's technical problems, Kennex recommends that customers use laser cutting, laser cutting is focused by the laser beam through the lens, at the focal point into a tiny spot, you can reach a few tens of microns a few microns minimum, the focus modulation To the workpiece plane, when sufficient power is applied to the object, the light energy is rapidly converted into heat energy, which can cause partial high temperature above 10000 ° C to instantly melt or even vaporize the workpiece, thereby cutting the workpiece to the depth we need or to cut through .